Data at the speed of light. Human capability enhanced by AI. Mobile gaming and intuitive camera functionality. All are made possible by advanced semiconductor packaging. Although advanced packaging has existed for decades, the rise of AI, high-performance computing, and responsive mobile technology have thrust it into the spotlight. Higher integration, 2.5D and 3D architectures, and extraordinary innovation make today’s digital world run – and Henkel materials are at the center of it all.
As the demands on semiconductor devices intensify year over year, advanced packaging techniques are providing the form factor and processing power required for today’s digitized world. System level integration, higher functionality, faster performance, and relentless miniaturization characterize the electronics market.
Advanced semiconductor packaging combines multiple chips into a single package, enabling communication at higher speeds and lower power compared to placing individually packaged chips on a printed circuit board. In 2.5 D packaging, die are arranged side by side on an interposer or bridge, allowing die-to-die interconnect, while 3D packaging stacks die vertically and connects them through vias. Both approaches present significant thermal, mechanical, performance and reliability challenges that demand highly specialized materials.
For some applications, advanced semiconductor packaging isn’t optional - it’s the only solution. AI and HPC, for example, require extreme computational power, fast processing, and smaller form factors that traditional packaging cannot deliver. Materials such as underfills, molding encapsulants, and adhesives to bond stabilizing lids and stiffeners, are the enablers of complex 2.5D and 3D packages.
Underfill innovation
No matter the application or process preference, Henkel has a solution. NCF, NCP, L-MUF, and CUF formats provide exceptional interconnect protection across a wide range of packaging designs.
Low warpage liquid compression molding
Anhydride-free liquid compression molding materials deliver post-cure ultra-low warpage across the wafer.
Lid and stiffener attach adhesives
Optimized formulations ensure package coplanarity and warpage control to prevent mechanical damage.
Advanced packaging architectures come with equally challenging materials decisions. Navigating CTE mismatches between chips and substrates, reliability expectations, and cost-performance trade-offs requires deep expertise and a proven portfolio. Consultation with a Henkel expert can help develop the right solution.
- EMI shielding
- Lid and stiffener attach adhesives
- Liquid compression molding
- Underfills
Electromagnetic interference (EMI) shielding has traditionally been managed at the PCB level, using enclosures around components to mitigate interference. But cans and cages are no longer sufficient. Today’s small, thin SiPs, MCMs, and heterogeneously integrated packages require a shielding layer in or directly on the component. Package-level EMI makes reliable RF device miniaturization and high-density integration possible.
The bonding of package lids and peripheral stiffeners to substrates is a technique used across applications, including high-performance computing, AI, automotive, 5G/telecom, memory and storage, and consumer electronics. Lid and stiffener attach adhesives bolster advanced semiconductor device reliability and performance, providing stability, protection from warpage, grounding or shielding capability, and thermal control for complex packages.
Semiconductor packages are more complex than ever, integrating thinner, higher-functioning, higher-density chips. Liquid compression molding materials, which enable wafer-level packaging, panel-level packaging, and molded underfill applications, are vital to this advancement, enabling cost-efficient, high-reliability packaging by shielding delicate ICs from damage during processing and in operation.
Fortifying electronic interconnects against mechanical damage is the job of underfill encapsulant materials. Without them, the thermal stress from processing or damage from shock, drop, or vibration could lead to electrical failure.
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