Case study

Headset manufacturer improves quality and reliability with LOCTITE^® instant component bonding

See how a global manufacturer of a True Wireless Stereo headset reduced field failures with LOCTITE^® instant component bonding.

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We, Henkel & Cie. AG, Salinenstrasse 61, 4133 Pratteln, Switzerland would like to personalize our digital services, retail activities and online advertising based on an analysis of your interactions with us, our websites and services (as stated under read more), to provide you and the company you are representing, with the most relevant and interesting content.

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A visual example of a wireless headset being used in action.

Results

As a result of using LOCTITE 402, the headsets have improved reliability with higher temperature resistance. The product successfully passed the drop test. The company reduced the overall cost of the product with a rework reduction from 2% to 0%.

Key results

Improved reliability with higher temperature resistance and passing drop test results
Reduced overall cost with rework reduction from 2% to 0%
Increased productivity with rapid fixture speed
Improved worker safety with non-HQ instant adhesive formula
Maintained strong brand and market position

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Headset manufacturer improves quality and reliability with LOCTITE^® instant component bonding

Get access now

Results

Key results

Related content

How to choose the right instant component bonding solution

Increase productivity. Improve reliability. Simplify design. Learn more about our instant component bonding solutions in our product guide.

Introducing LOCTITE^® 402 for fast fixture, high strength, and ultra-high performance

The industry’s pursuit of developing smaller devices of higher performance is driving the need for better assembly solutions, including adhesives, able to withstand performance requirements like heat.

How to improve occupational health and safety with LOCTITE^® instant adhesives

Mobile phone accessory manufacturer improves product reliability with LOCTITE^® instant component bonding

To reduce product failure and optimize production process, a manufacturer of phone holders sought to switch from a mechanical snap fit to a fast-curing bonding solution.