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Discover how Henkel's semi-sintering die attache pastes surpass the thermal constraints of conventional die attach materials and simplify the intricate processes associated with pure sintering paste.
Effectively managing heat is crucial for ensuring the reliable operation of devices. As devices become smaller and more powerful, dealing with thermal load becomes increasingly challenging. Henkel's semi-sintering portfolio offers flexibility and high elongation (toughness), enhancing thermal cycling performance and, consequently, reliability.
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Device miniaturization and its challenges -
Limitation of conventional die attach materials -
Characteristics and benefits of LOCTITE® ABLESTIK® ABP 8068T semi-sintering die attach paste series
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