White paper
Discover how Henkel's conductive die attach film offer unprecedented reliability and efficiency for the next-gen broadband technology.
Conductive die attach film is enabling continued miniaturization and delivering more design and processing latitude for high-density, system-in-package components. As compared to conductive die attach paste, conductive die attach film is superior in many respects: film adhesive eliminates concerns with die tilt, provides consistent bondline control and use across die sizes, and eliminates the fillet, allowing tighter die placement while requiring less Au wire for wire bonding.
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