Protecting technologies for electronics - Underfill, Glob Top and Dam&Fill

28th May 2026, 10:00am CET
Online

Enhancing electronics reliability

Protection materials are some of the most vital elements of next-generation electronic system design. Safeguarding function and extending the useful life of electronic systems are vital to protecting investment. Recognizing this need, we are organizing a 90-minute webinar focused on protecting technologies for electronics, with emphasis on underfill, glob top and dam and fill solutions.

Key insights

Essential protection against thermal, mechanical stress
Reliable performance for high-density assemblies
Efficient processing with underfill and encapsulants

Featured speakers

Kris Machiels
Principal Application Engineer

Tom Pilgram
Technician Application Engineering

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Protecting technologies for electronics - Underfill, Glob Top and Dam&Fill

Enhancing electronics reliability

Key insights

Featured speakers

Sign up for the webinar

Personal details

Company details

Looking for solutions? We can help

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