Case study

Performance demands for high bandwidth 5G telecom

This case study looks at how ultra-high thermal conductivity, heat-dissipating gel meets processing, performance demands for high bandwidth 5G telecom infrastructure systems.

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This image shows a telecommunication tower in the city.

Challenge

A new 5G massive MIMO active antenna design integrates high-power density components to deliver improved data throughput performance. The advanced ICs within the device generate very high heat. To ensure excellent performance, several thermal, processing, architectural and environmental challenges must be overcome, including: higher operational temperatures versus previous-generation components; smaller, lighter devices with greater thermal loads; deployment in dense urban areas and in elevated, difficult-to-service locations; high-volume production demands.

Results

Henkel has developed a 10.0 W/m-K gel TIM that offers higher thermal conductivity than its predecessor but, remarkably, also has a nearly 30% increased flow rate as demonstrated by a simple cartridge dispense test. Formulating a material of this caliber that provides comprehensive performance and processing capability – high conductivity and excellent/stable dispensability -- is exceptional.
In rheology (dispensability) testing, Henkel’s BERGQUIST^® LIQUI FORM TLF 10000 outperformed other evaluated materials.
BERGQUIST^® LIQUI FORM TLF 10000 gel TIM satisfies the intense heat dissipation requirements of new high bandwidth industrial infrastructure systems, including telecom and datacom applications. The formulation balances high thermal conductivity, low stress, automated dispensability, production consistency and in-application stability.

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Performance demands for high bandwidth 5G telecom

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