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Henkel Adhesive Technologies

Henkel Adhesive Technologies

White Paper

Benefits for 3D packaging technology

Learn about Henkel's innovation in NCF materials that addresses the demands of 3D through-silicon via (TSV) memory chip processing, system in package (SiP) configurations and other heterogeneous integration design.

This is a front cover for the 3d packaging technologies white paper

This white paper explains the benefits of NCF for advanced packaging processing and introducing the latest NCF material, wafer-applied underfill films, designed to balance flow behavior and cure kinectics, providing good fillet coverage and complete gap filling.

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