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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Compounds for electronics

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  • A packshot of LOCTITE ECCOBOND UF 8830S, a black material in 2 different sizes showing a 30CC syringe and a 10CC syringe.

    Encapsulants

    LOCTITE® ECCOBOND UF 8830S

    High purity encapsulant for rigid sealing flip-chip BGAs

  • A packshot of LOCTITE ECCOBOND UV 9052, black UV syringes in 3 different sizes showing a 55CC syringe, a 30CC syringe, and a 10CC syringe.

    Encapsulants

    LOCTITE® ECCOBOND UV 9052

    Encapsulant adhesive for ink jet applications 

  • Loctite UK 3182 B - 1 gallon can (IDH 233626)

    Potting compounds

    LOCTITE® UK 3182

    Low-shrinkage potting compound

  • Loctite SI 5623 - 400 ml dual cartridge (IDH 1259300)

    Potting compounds

    LOCTITE® SI 5623

    Thermal and mechanical shock resistant silicone

  • A packshot of LOCTITE STYCAST 2651MM in 2 different sizes showing a 1GAL can and a 5GAL pail.

    Potting compounds

    LOCTITE® STYCAST 2651MM

    Low-viscosity, low abrasion, general purpose filled encapsulant  

  • Loctite SI 5611F - 490 ml dual cartridge (IDH 1385991)

    Potting compounds

    LOCTITE® SI 5611F

    Fast-cure, self-leveling silicone liquid

  • LOCTITE SI 5140 Potting Compound - 300ml cartridge (IDH 135263)

    Potting compounds

    LOCTITE® SI 5140

    Silicone-based potting compound and sealant

  • FERMASIL B-component 110kg (alternatively 180kg) and 25 kg

    Potting compounds

    SONDERHOFF Fermasil B-33-4

    Silicone-based part to form a foam gasket for, e.g., distance sensors

  • Family packshot for clear conformal coating adhesive LOCTITE STYCAST CC 8555 in 2 parts showing 2 1 GAL cans and 2 5 GAL pails.

    Conformal coatings

    LOCTITE® STYCAST CC 8555

    VOC- and solvent-free conformal coating

  • LOCTITE ECCOBOND UF 9000AG

    Underfills

    LOCTITE® ECCOBOND UF 9000AG

    Underfill encapsulant for flip-chip BGA and Cu pillars

  • Packshot for LOCTITE ECCOBOND 3707

    Fill encapsulants

    LOCTITE® ECCOBOND 3707

    No-flow encapsulant for local circuit board protection 

  • Individual Packshot for TECHNOMELT PUR 6220 in a black pail

    Potting compounds

    TECHNOMELT® PUR 6220 UV

    Reactive hotmelt adhesive system for lamination and general assembly