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Henkel Adhesive Technologies
Encapsulants
LOCTITE® ECCOBOND UF 8830S
High purity encapsulant for rigid sealing flip-chip BGAs
LOCTITE® ECCOBOND UV 9052
Encapsulant adhesive for ink jet applications
Potting compounds
LOCTITE® UK 3182
Low-shrinkage potting compound
LOCTITE® SI 5623
Thermal and mechanical shock resistant silicone
LOCTITE® STYCAST 2651MM
Low-viscosity, low abrasion, general purpose filled encapsulant
LOCTITE® SI 5611F
Fast-cure, self-leveling silicone liquid
LOCTITE® SI 5140
Silicone-based potting compound and sealant
SONDERHOFF Fermasil B-33-4
Silicone-based part to form a foam gasket for, e.g., distance sensors
Conformal coatings
LOCTITE® STYCAST CC 8555
VOC- and solvent-free conformal coating
Underfills
LOCTITE® ECCOBOND UF 9000AG
Underfill encapsulant for flip-chip BGA and Cu pillars
Fill encapsulants
LOCTITE® ECCOBOND 3707
No-flow encapsulant for local circuit board protection
TECHNOMELT® PUR 6220 UV
Reactive hotmelt adhesive system for lamination and general assembly