Part no. (SKU/IDH):
1276176
IDH Name:
LOCTITE® ABLESTIK 8008HT, 10 cc Syringe
Thermally conductive adhesives
Die attach adhesive for high power devices in high UPH environment
A 1-part, proprietary hybrid chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high power devices in a high UPH environment.
Marketing materials
Part no. (SKU/IDH):
1276176
IDH Name:
LOCTITE® ABLESTIK 8008HT, 10 cc Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ABLESTIK 8008HT die-attach adhesive is perfect for high power devices in a high UPH environment. A lead-free alternative to soft solder and eutectic, it can potentially reduce the layers of backside metallization required. It can be applied to a wafer backside by stencil printing, B-staged in an oven, then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. Should be used with a pressure sensitive dicing tape. Not compatible with UV dicing tapes.
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Electrically conductive
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Thermally conductive
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Snap curable after B-stage
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Low modulus
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Not compatible with UV dicing tapes
- Product category:
- Die attach adhesives
Technologies:
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Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 37.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 62.0 ppm/°C
- Color:
- Silver
- Cure schedule, Snap Cure, @ 170.0 °C:
- 20.0 sec.
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 9.0 ppm
- Extractable ionic content, Potassium (K+):
- 9.0 ppm
- Extractable ionic content, Sodium (Na+):
- 9.0 ppm
- Glass transition temperature (Tg):
- 264.0 °C
- Hot die shear strength, @ 260.0 °C:
- 2.6 kg-f
- RT die shear strength, 2 x 2 mm Si die on Cu leadframe:
- 6.0 kg-f
- Tensile modulus, @ 250.0 °C:
- 2451.0 N/mm² (355340.0 psi)
- Thermal conductivity:
- 11.0 W/mK
- Thixotropic index:
- 4.0
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 50000.0 mPa·s (cP)
- Volume resistivity:
- 0.00005 Ohm cm
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