Hot melt adhesives
Thermoplastic hot melt for moulding applications
A 1-part, low-viscosity, thermoplastic hot melt adhesive specially designed for moulding applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
TECHNOMELT® PA 2302 BLACK is a 1-part polyamide hot melt adhesive formulated for moulding processes. Its low viscosity makes it ideal for encapsulating fragile components without damage. Once applied, it solidifies to form a barrier between electronics and the environment. Ideal for potting electronics modules, moulding strain relief into wiring, and encapsulation of sensors. A versatile adhesive for a variety of substrates.
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1-part: no mixing required
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Low viscosity
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Moulding temperature 220°C to 240°C (428°F to 464°F)
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Easy mouldability
- Product category:
- Hot melt adhesives
Technologies:
-
Hot Melts, polyamide
- Applications:
- Encapsulating
- Color:
- Black
- Number of components:
- 1 part
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