Encapsulants
Thermoplastic adhesive for encapsulating and potting electronic components
This 1-part, thermoplastic adhesive is formulated from renewable materials and is particularly suitable for encapsulating and potting electronic components.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
TECHNOMELT® PA 62 is an amber-coloured, thermoplastic, 1-part adhesive formulated from renewable raw materials. It is particularly suitable for encapsulating and potting electronic components, providing robust protection against environmental factors. It is applied in its molten state and solidifies upon cooling, forming a strong bond with substrates such as metals, plastics, and ceramics.
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Versatile substrate compatibility
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Easy application
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Oil- and high-temperature-resistant
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1 part: no mixing required
- Product category:
- Encapsulants
Technologies:
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Hot Melts, polyamide
