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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Low pressure moulding

Sustainable and cost-effective, low-pressure moulding can reduce PCB protection costs compared to potting, conformal coating and sealing methods.

Polymer granulate

Henkel TECHNOMELT® and LOCTITE® low-pressure moulding solutions offer an efficient, low-cost alternative to conventional multi-step, multi-material PCB protection methods. With Henkel's simple three-step process, parts are inserted into the mould set, overmoulded and then tested. Low-pressure moulding also eliminates messy two-part material mixing routines, device preparation (masking), long cure times and material waste.

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