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Discover Henkel's broad portfolio for advanced semiconductor packaging – from underfills, encapsulants, lid and stiffener attach adhesives, to package-level EMI solutions for applications including flip chip, wafer-level packaging, and 3D TSV memory.
With a strong development pipeline of solutions for challenging flip-chip and package-on-package designs, fan-in and fan-out wafer-level packaging (WLP) and 2.5D/3D integrated architectures, Henkel semiconductor packaging materials ensure long-term reliability, optimised performance, and high-UPH processability.
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