Part no. (SKU/IDH):
1200205
IDH Name:
LOCTITE® ABLESTIK 8700K
Thermally conductive adhesives
Non-slump, die-attach adhesive for gold film surfaces
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
Part no. (SKU/IDH):
1200205
IDH Name:
LOCTITE® ABLESTIK 8700K
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{#distributor.prices.regularWithSymbol}} {{/distributor.withoutSpecialPrice}}{{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} In stock {{#distributor.notInStock}} Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{^distributor.notInStock}} {{#distributor.onShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly. You will receive an email notification when product is back in stock.You will not receive an email notification when product is back in stock.
{{/distributor.isExpanded}}
{{^distributor.isExpanded}}
{{/distributor.isExpanded}}
{{/distributor.isVisible}}
{{/data}}
- Description
- Technical specification
LOCTITE® ABLESTIK 8700K is a heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
-
Non-conductive
-
Excellent adhesion
-
For thin and thick film gold surfaces
-
Heat cure
-
Non-slump
- Product category:
- Thermally conductive adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 20.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 55.0 ppm/°C
- Color:
- White
- Cure schedule, @ 175.0 °C:
- 1.0 hr.
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 165.0 °C
- RT die shear strength, 2 x 2 mm on Gold:
- 5000.0 kg-f
- Thermal conductivity:
- 0.5 W/mK
- Viscosity, @ 25.0 °C:
- 45000.0 mPa·s (cP)
- Volume resistivity:
- 3x10¹⁴ Ohm cm
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
- {{^distributor.unique}} {{/distributor.unique}} {{/distributor.isExpanded}} {{^distributor.isExpanded}} {{/distributor.isExpanded}} {{/distributor.isVisible}} {{/data}}