Part no. (SKU/IDH):
1199755
IDH Name:
LOCTITE® ABLESTIK 8700K
Thermally conductive adhesives
Non-slump, die-attach adhesive for gold film surfaces
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin-film and thick-film gold surfaces.
Part no. (SKU/IDH):
1199755
IDH Name:
LOCTITE® ABLESTIK 8700K
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
- {{^distributor.unique}} {{/distributor.unique}} {{/distributor.isExpanded}} {{^distributor.isExpanded}} {{/distributor.isExpanded}} {{/distributor.isVisible}} {{/data}}
- Description
- Technical specification
LOCTITE® ABLESTIK 8700K is a heat-cure, die-attach, epoxy adhesive for excellent adhesion to both thin-film and thick-film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
-
Non-conductive
-
Excellent adhesion
-
For thin- and thick-film gold surfaces
-
Heat cure
-
Non-slump
- Product category:
- Thermally conductive adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 20.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 55.0 ppm/°C
- Color:
- White
- Cure schedule, @ 175.0 °C:
- 1.0 hr.
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 165.0 °C
- RT die shear strength, 2 x 2 mm on Gold:
- 5000.0 kg-f
- Thermal conductivity:
- 0.5 W/mK
- Viscosity, @ 25.0 °C:
- 45000.0 mPa·s (cP)
- Volume resistivity:
- 3x10¹⁴ Ohm cm
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
- {{^distributor.unique}} {{/distributor.unique}} {{/distributor.isExpanded}} {{^distributor.isExpanded}} {{/distributor.isExpanded}} {{/distributor.isVisible}} {{/data}}
Our experts are here to learn more about your needs.
Our support center and experts are ready to help you find solutions for your business needs.