Part no. (SKU/IDH):
892666
IDH Name:
LOCTITE® 3875, Part B, 30 ml Syringe
Thermally conductive adhesives
Bead-on-bead, thermally conductive adhesive for electronic components
This 2-part, acrylate-based, thermally conductive adhesive is designed to couple and bond heat sinks to heat-dissipating electronic components.
Part no. (SKU/IDH):
892666
IDH Name:
LOCTITE® 3875, Part B, 30 ml Syringe
Component part Please make your selection Part B
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® 3875 is a 2-part, bead-on-bead, thermally conductive adhesive designed to thermally couple and structurally bond heat sinks to heat-dissipating electronic components. It's typically used for transistors, rectifiers, and computing applications such as memory chips, chipsets, and graphic processor assemblies. When mixed, it cures at room temperature and doesn't require a primer or heat.
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2-part: mixing required
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Easy to use
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Thermally conductive: 2.0 W/m-K
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Suitable for a wide array of electronic components
- Product category:
- Thermally conductive adhesives
Technologies:
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Non-methyl methacrylate (MMA) structural adhesives
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