Part no. (SKU/IDH):
1861555
IDH Name:
LOCTITE® ECCOBOND NCP 5209, 10 cc
Electrically non-conductive adhesives
Non-conductive, pre-applied underfill adhesive for thermal compression
This yellow non-conductive die-attach adhesive is designed for thermal compression bonding processes in flip chip to laminate assembly.
Part no. (SKU/IDH):
1861555
IDH Name:
LOCTITE® ECCOBOND NCP 5209, 10 cc
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ECCOBOND NCP 5209 is a pale yellow, acrylate-based, non-conductive die-attach adhesive for advanced flip chip Cu pillar applications. It leverages thermal compression bonding for robust bump protection. It is compatible with small assembly gaps and tight pitches and is typically used as a pre-applied underfill to provide optimal fluxing activity for good solder joint formation. Cures fast when exposed to heat.
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Low ionic impurities
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Fast curing
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Non-conductive
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Offers excellent protection of electrical joints
- Product category:
- Electrically non-conductive adhesives
Technologies:
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Thermosets, electronics semiconductor materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 80.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 28.0 ppm/°C
- Extractable ionic content, Chloride (CI-):
- 10.0 ppm
- Extractable ionic content, Potassium (K+):
- 10.0 ppm
- Extractable ionic content, Sodium (Na+):
- 10.0 ppm
- Glass transition temperature (Tg):
- 145.0 °C
- Storage modulus, DMA, @ 25.0 °C:
- 7.3 GPa (7300.0 N/mm², 1058775.0 psi)
- Storage temperature:
- -40.0 °C
- Viscosity, @ 25.0 °C:
- 12500.0 mPa·s (cP)
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