Part no. (SKU/IDH):
452116
IDH Name:
LOCTITE® ECCOBOND FP4460, 30 cc Syringe
Glob top materials
Epoxy encapsulant for protection of bare semiconductor devices
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.
Part no. (SKU/IDH):
452116
IDH Name:
LOCTITE® ECCOBOND FP4460, 30 cc Syringe
Size Please make your selection 30 cc
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{#distributor.prices.regularWithSymbol}} {{/distributor.withoutSpecialPrice}}{{/distributor.prices.regularWithSymbol}}{{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{^distributor.notInStock}} {{#distributor.onShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
- Description
- Technical specification
LOCTITE® ECCOBOND FP4460 encapsulant is specially designed for the protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. You can expect high flow, high temperature performance, excellent chemical resistance, and excellent moisture resistance.
-
Low stress
-
High purity
-
Improved work life
-
High temperature performance
- Product category:
- Encapsulants
Technologies:
-
Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Below Tg:
- 20.0 ppm/°C
- Color:
- Black
- Cure schedule, @ 150.0 °C:
- 3.0 hr.
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 173.0 °C
- Operating temperature:
- -65.0 °C - 150.0 °C
- Specific gravity, @ 25.0 °C:
- 1.78
- Viscosity, Brookfield - RVF, @ 25.0 °C:
- 300000.0 mPa·s (cP)
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
- {{^distributor.unique}} {{/distributor.unique}} {{/distributor.isExpanded}} {{^distributor.isExpanded}} {{/distributor.isExpanded}} {{/distributor.isVisible}} {{/data}}
