Part no. (SKU/IDH):
610821
IDH Name:
LOCTITE ABLESTIK QMI529HT
Thermally conductive adhesives
Electrically conductive die-attach adhesive for high-reliability package applications
A 1-part, BMI acrylate-based, conductive die-attach adhesive designed for bonding integrated circuits and components to metal substrates.
Part no. (SKU/IDH):
610821
IDH Name:
LOCTITE ABLESTIK QMI529HT
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{#distributor.prices.regularWithSymbol}} {{/distributor.withoutSpecialPrice}}{{/distributor.prices.regularWithSymbol}}{{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{^distributor.notInStock}} {{#distributor.onShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
- Description
- Technical specification
LOCTITE® ABLESTIK QMI529HT is a silver, thermally and electrically conductive die-attach adhesive designed as a soft-solder replacement or for high UPH performance applications. It’s typically used on copper, silver-plated copper, pre-plated lead frames (Ni/Pd/Au) and Alloy 42. LOCTITE ABLESTIK QMI529HT exhibits excellent adhesive strength and good resistance to "popcorning" after exposure to reflow temperatures. It’s formulated with a BMI acrylate-based resin and cures when exposed to heat. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater.
-
Compatible with many metal substrates
-
High resistance to heat and humidity
-
Hydrophobic
-
Void-free bond line
-
High resistance to delamination
- Product category:
- Die attach adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 53.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 20.0 ppm
- Extractable ionic content, Fluoride (F-):
- 20.0 ppm
- Extractable ionic content, Potassium (K+):
- 20.0 ppm
- Extractable ionic content, Sodium (Na+):
- 20.0 ppm
- Hot die shear strength, @ 245.0 °C:
- 21.0 kg-f
- Key characteristics:
- Conductivity: electrically conductive; Conductivity: thermally conductive
- Number of components:
- 1 part
- Physical form:
- Paste
- RT die shear strength, 7.62 x 7.62 mm die on Ag/Cu leadframe:
- 57.0 kg-f
- Recommended for use with:
- LeadFrame: gold; LeadFrame: silver
- Tensile modulus, @ 25.0 °C:
- 3300.0 N/mm² (478500.0 psi)
- Thixotropic index:
- 4.8
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
- {{^distributor.unique}} {{/distributor.unique}} {{/distributor.isExpanded}} {{^distributor.isExpanded}} {{/distributor.isExpanded}} {{/distributor.isVisible}} {{/data}}
