Film adhesives
Film adhesive for electrical, thermal and mechanical assembly applications
This silver-filled flexible adhesive film offers high electrical and thermal conductivity, and uniform bondline adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK CF 3350 is a silver-filled flexible film adhesive with high electrical and thermal conductivity, as well as uniform bondline adhesion. It is clean and easy to apply, passes NASA outgassing requirements, and is available in custom preforms. Perfect for circuit board materials, metal backplanes, and heat sinks.
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Uniform bondline adhesion
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High thermal and electrical conductivity
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Silver-filled
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Minimum thermal resistance to heat sink
- Product category:
- Film adhesives
Technologies:
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Thermosets, electronics assembly materials
- Cure schedule, @ 150.0 °C:
- 30.0 min.
- Cure type:
- Heat cure
- Physical form:
- Film
- Thermal conductivity:
- 7.0 W/mK
FAQ
Yes. Assembly film is regularly cut into preform shapes to exactly match customer specifications.
Henkel utilizes 3 different methods to cut preforms, a die cutter, laser cutter and knife plotter. Each method has benefits as well as limitations. Henkel chooses the best and most appropriate method to cut a preform on a case by case basis.
Assembly film is cured by a combination of heat and pressure. Typical cure schedules are 125C / 2 hours or 150C / 30 minutes while maintaining pressure of a minimum 2-10 psi.
Simple spring clamps or weights are commonly used to apply pressure to assembly film during cure. Other more advanced methods include vacuum bagging and vacuum presses.
To maximize adhesive performance, a clean substrate is required. Industry standard cleaning methods include solvent cleaning, mechanical abrasion / cleaning or chemical treatment.
