Electrically conductive adhesives
Electrically conductive bonder for component assembly on mismatched substrates
A 1-part, solvent-free, electrically conductive adhesive that combines low stress with good adhesion on nearly all surfaces, including applications with mismatched CTE (Coefficient of Thermal Expansion).
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK CE 8500-S39 is a 1-part, solvent-free, electrically conductive, modified epoxy adhesive for component assembly. It combines low stress with good adhesion on nearly all surfaces, and is ideal for mismatched substrates, including applications with mismatched CTE (Coefficient of Thermal Expansion). It has 39 µm spacers for bondline thickness control, and its operating temperature is -45°C to 200°C (-49°F to 392°F).
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1-part: no mixing required
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Low stress
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39 µm spacers for bondline thickness control
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Operating temperature: -45°C to 200°C (-49°F to 392°F)
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Solvent free
- Product category:
- Electrically conductive adhesives
Technologies:
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Thermosets, electronics assembly materials
- Cure schedule, @ 120.0 °C:
- 90.0 min.
- Cure type:
- Heat cure
- Number of components:
- 1 part
- Operating temperature:
- 200.0 °C
- Shear strength:
- 435.0 psi
- Storage temperature:
- -25.0 °C - -18.0 °C
- Viscosity, Brookfield, @ 25.0 °C:
- 130000.0 mPa·s (cP)
