Part no. (SKU/IDH):
2126723
IDH Name:
LOCTITE ABLESTIK CDF 515P8C8
Film adhesives
Electrically conductive die-attach adhesive for high-reliability package applications
A 1-part, highly filled conductive die-attach adhesive designed for bonding integrated circuits and components to metal substrates.
Part no. (SKU/IDH):
2126723
IDH Name:
LOCTITE ABLESTIK CDF 515P8C8
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ABLESTIK CDF 500 is a silver, highly filled, thermally and electrically conductive die-attach adhesive paste for bonding integrated circuits and components to metal substrates. It offers strong adhesion to various wafer metallizations and lead frame finishes and is typically used for QFN, TQFP and eTQFP package applications. It works on various die sizes ranging from 3 mm x 3 mm (0.12" x 0.12") to 8 mm x 8 mm (0.31" x 0.31") and is ideal when tight control of resin bleed-out is required. LOCTITE ABLESTIK ABP 8303A is based on hybrid chemistry, cures when exposed to heat and provides a consistent bond line thickness.
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Good for thin wafer handling applications
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Film thickness: 15 µm and 30 µm
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Offers high MSL reliability
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No resin bleed-out
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Low in-package thermal and electrical resistance
- Product category:
- Electrically conductive adhesives
Technologies:
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Thermosets, electronics semiconductor materials
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