Die attach adhesives
Semiconductor die-attach paste with excellent thermal properties
This semiconductor die-attach paste is designed for applications requiring good thermal management and robust mechanical properties.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK ABP 8920TC is a white, alumina-filled, thermally conductive die-attach adhesive paste for applications requiring good thermal management and robust mechanical properties. It's compatible with BT, copper, silver, PPF and alloy 42 substrates. It's based on a BMI hybrid with alumina filler and cures when exposed to heat.
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High MRT performance
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High thermal conductivity
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Good adhesion and electrical insulation
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Small and controlled particle size
- Product category:
- Electrically non-conductive die attach pastes
Technologies:
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Thermosets, electronics semiconductor materials
