Die attach adhesives
Medium to large die-attach electrically non-conductive adhesive
This electrically-insulating die-attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK ABP 8910T is a heat cure, electrically non-conductive adhesive ideal for use on medium to large die sizes, and perfect for copper, silver, PPF and alloy 42 substrates. It has high MRT performance, high thermal conductivity, and high reliability.
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High MRT performance
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High thermal conductivity
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Electrically insulating
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High reliability
- Product category:
- Electrically non-conductive die attach pastes
Technologies:
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Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 28.0 ppm/°C
- Cure type:
- Heat cure
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 13000.0 mPa·s (cP)
