Die attach adhesives
Conductive die-attach paste for high-reliability package applications
This silver-filled conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK ABP 8303A is a silver-filled, conductive die-attach adhesive paste for bonding integrated circuits and components to metal substrates. It offers strong bonding of medium- and large-sized dice and is compatible with a wide array of metal surfaces, including Cu, Ag and PPF. It's particularly ideal when tight control of resin bleed-out is required. It is based on a BMI hybrid and cures when exposed to heat.
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Moderate modulus
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Good adhesion to Cu, Ag and PPF
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Offers low stress
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Low outgassing
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Hydrophobic
- Product category:
- Die attach pastes
Technologies:
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Thermosets, electronics semiconductor materials
