Die attach adhesives
Semi-sintering die-attach adhesive for semiconductor packages
This 1-part, semi-sintering, conductive die-attach adhesive is designed for high-reliability package applications and bonds to various metal surfaces.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK ABP 8068TD is a silver, thermally and electrically conductive die attach adhesive for high-reliability package applications, typically SIP, QFN, LGA and HBLED packages. It offers robust bonding on various metal surfaces, including Ag, Cu, PPF and Au lead frames and is engineered to bond with or without BSM (Back Side Metallization) dies. It is formulated with an epoxy-assisted sintering technology, cures when exposed to heat and provides high adhesion, high thermal and low-stress properties, which are essential for thermal and reliability performances of high-end power packages, such as SiP.
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Good adhesion to PPF, Ag, Cu and Au
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Good workability
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High reliability
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Offers low stress
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High thermal and electrical conductivity
- Product category:
- Die attach pastes
Technologies:
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Thermosets, electronics semiconductor materials
