Part no. (SKU/IDH):
1201266
IDH Name:
LOCTITE® ABLESTIK 8387B
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Non-conductive adhesive for high-throughput die-attach applications
This black non-conductive adhesive is designed for optoelectronic devices in aerospace and defence devices.
Part no. (SKU/IDH):
1201266
IDH Name:
LOCTITE® ABLESTIK 8387B
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ABLESTIK 8387B is a black, non-conductive epoxy adhesive for high-throughput die-attach applications. It’s particularly used for glass attachment to optical and 3D sensors in aerospace and defence applications. It cures fast when exposed to direct heat energy or hot-plate techniques. In conventional box- or convection conveyor oven curing, it will cure at temperatures as low as 100°C (212°F). If cured properly, it should pass the NASA outgassing standards.
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Fast-curing
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Good adhesion to glass
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Jettable
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Non-conductive
- Application method:
- Dispense system
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 94.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 165.0 ppm/°C
- Color:
- Black
- Cure schedule, @ 150.0 °C:
- 2.0 min
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 299.0 ppm
- Extractable ionic content, Potassium (K+):
- 4.0 ppm
- Extractable ionic content, Sodium (Na+):
- 9.0 ppm
- Glass transition temperature (Tg):
- 96.0 °C
- Hot die shear strength, @ 250.0 °C:
- 270.0 kg-f
- Key characteristics:
- Conductivity: electrically non-conductive; Cure speed: fast cure
- Number of components:
- 1 part
- Physical form:
- Paste
- RT die shear strength, 3 x 3 mm Si die on Cu LF @ 25°C:
- 4400.0 psi
- Recommended for use with:
- Laminate; LeadFrame: silver
- Tensile modulus, DMTA, @ 250.0 °C:
- 53.0 N/mm² (7700.0 psi)
- Thixotropic index:
- 4.5
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 9500.0 mPa·s (cP)
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