Die attach adhesives
Electrically conductive die-attach adhesive for high-reliability packages
A 1-part, silver-filled, electrically conductive die-attach adhesive paste designed for high-reliability package applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK 8200T is a silver, electrically conductive die-attach adhesive for high-reliability package applications that require medium thermal and electrical conductivity. It's particularly ideal for PPF and silver substrates and exhibits improved JEDEC performance on QFN-type packages. LOCTITE ABLESTIK 6202C-X is designed with a proprietary hybrid chemistry technology and cures snappy when exposed to heat (it’s oven-curable).
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Snap curable
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Offers low bleed
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Improved JEDEC performance
- Product category:
- Die attach adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 61.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 9.0 ppm
- Extractable ionic content, Potassium (K+):
- 29.0 ppm
- Extractable ionic content, Sodium (Na+):
- 9.0 ppm
- Hot die shear strength:
- 7.0 kg-f
- RT die shear strength:
- 10.0 kg-f
- Tensile modulus, @ 250.0 °C:
- 2921.0 N/mm² (423655.0 psi)
