Part no. (SKU/IDH):
1189654
IDH Name:
LOCTITE® ABLESTIK 59C
Electrically conductive adhesives
Electrically conductive adhesive for high-temperature applications
A 1-part, silver, thixotropic, electrically conductive die-attach adhesive for applications requiring high-temperature exposures up to 260°C (500°F).
Part no. (SKU/IDH):
1189654
IDH Name:
LOCTITE® ABLESTIK 59C
Packaging type Please make your selection Other pack. types, not spec.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ABLESTIK 59C is a silver, silicone-based, electrically and thermally conductive die-attach adhesive for high-temperature applications requiring electrical conductivity and not requiring high bond strength. It’s reworkable and compatible with a variety of catalysts. LOCTITE ABLESTIK 59C is a pressure-sensitive adhesive with high flexibility and tack. Its thixotropic nature makes it easy to apply and reduces sealant migration after application.
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Thixotropic for ease of application
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High thermal stability
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Electrically conductive
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Service/operating temperature: -55°C to 260°C (-67°F to 500°F)
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Reworkable
- Product category:
- Electrically conductive adhesives
Technologies:
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Silicones, specialty
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Thermosets, electronics assembly materials
- Cure schedule, @ 150.0 °C:
- 6.0 hr.
- Cure type:
- Heat cure
- Number of components:
- 1 part
- Operating temperature:
- -55.0 °C - 260.0 °C
- Shear strength, Aluminum:
- 20.0 psi
- Storage temperature:
- 25.0 °C
- Volume resistivity, @ 25.0 °C:
- 0.0002 Ohm cm
How to use
Complete cleaning of the substrates should be performed to remove contamination such as oxide layers, dust, moisture, salt and oils which can cause poor adhesion or corrosion in a bonded part.
During shipping and storage, separation of components within the packaging container can occur. For this reason, it is recommended that the products be thoroughly mixed prior to use.
Apply adhesive to all surfaces to be bonded and join together. Allow the solvent to evaporate until the film passes through a highly tacky state and then becomes only slightly tacky. This process normally takes 10 to 20 minutes.
Join surfaces to be bonded and apply pressure. Usually, hand pressure is satisfactory.
If the adhesive is allowed to stand too long on the surfaces, all tackiness will be lost. Tackiness can usually be restored by applying small amounts of solvents to the surface.
FAQ
Electrically conductive adhesives (ECAs) deliver more secure electrical interconnection and more reliability versus traditional soldering, especially in challenging application environments (e.g. varying temperatures or dissimilar materials). They are metal filled adhesives with the ability to conduct electric current, typically consisting of a polymeric resin, a hardener and a conductive filler.
Thixotropy comes from the two Greek words thixis (shaking or mixing) and trepo (turning or changing). It refers to the viscosity being temporarily reduced when a stress is applied, e.g. product being extruded/stirred. Thixotropic adhesives allow for managing the flow during and after application. Meaning they are easy to extrude but stay in place after application as they revert back to their initial, thicker state.
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