Die attach adhesives
Die-attach adhesive for Pb-free applications
This fast-cure die-attach adhesive is designed for Pb-free plastic ball grid array (PBGA) and array BGA packaging.
Marketing materials
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK 2100A is a silver die-attach adhesive for Pb-free PBGA and array BGA packaging, made to withstand 500°F (260°C) reflow. It’s designed with a proprietary hybrid chemistry technology, offers excellent dispensing characteristics and cures fast when exposed to heat. It exhibits high hot/wet adhesion, low stress and bleed and ultra-low moisture absorption.
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Suitable for die sizes up to 12.7 mm x 12.7 mm (0.5" x 0.5")
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Ultra-low moisture absorption
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Designed for Pb-free applications
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Low stress and low bleed
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Fast curing
- Product category:
- Die attach adhesives
Technologies:
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Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 65.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 9.0 ppm
- Extractable ionic content, Potassium (K+):
- 9.0 ppm
- Extractable ionic content, Sodium (Na+):
- 9.0 ppm
- Hot die shear strength:
- 5.0 kg-f
- RT die shear strength:
- 16.0 kg-f
- Tensile modulus, DMTA, @ 250.0 °C:
- 234.0 N/mm² (34000.0 psi)
- Tensile modulus, DMTA, @ 65.0 °C:
- 3172.0 N/mm² (460000.0 psi)
