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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Part no. (SKU/IDH):
1202288

IDH Name:
LOCTITE® ABLESTIK 2053S

Electrically non-conductive adhesives

LOCTITE® ABLESTIK 2053S

Non-conductive die-attach adhesive for array packaging

This red, non-conductive die-attach adhesive is designed for flex, laminate and die-to-die.

Part no. (SKU/IDH):
1202288

IDH Name:
LOCTITE® ABLESTIK 2053S

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

LOCTITE® ABLESTIK 2053S is a polymer-filled, hybrid, non-conductive die-attach adhesive for array packaging. It's typically used for the ASIC (Application Specific Integrated Circuit) attach of automotive optical sensors, and as a receiver and die-attach for 3D sensing modules. It's proven effective on various substrates, such as EMC, engineering plastic, glass and metals, and offers low warpage, stress and moisture uptake. It s a low-modulus adhesive, making it ideal for wire bonding small die sizes and chip bonding on FR4 substrates. It cures when exposed to heat.

  • Product category:
  • Die attach adhesives

Technologies:

  • Applications:
  • Die attach

 

  • Coefficient of thermal expansion (CTE):
  • 149.0 ppm/°C

 

  • Coefficient of thermal expansion (CTE), Above Tg:
  • 216.0 ppm/°C

 

  • Cure type:
  • Heat cure

 

  • Extractable ionic content, Chloride (CI-):
  • 9.0 ppm

 

  • Extractable ionic content, Potassium (K+):
  • 9.0 ppm

 

  • Extractable ionic content, Sodium (Na+):
  • 9.0 ppm

 

  • Glass transition temperature (Tg):
  • -21.0 °C

 

  • Hot die shear strength:
  • 2.1 kg-f

 

  • RT die shear strength:
  • 6.0 kg-f

 

  • Tensile modulus, @ 250.0 °C:
  • 22.0 N/mm² (3200.0 psi)

 

  • Thixotropic index:
  • 2.5

 

  • Viscosity, Brookfield CP51, @ 25.0 °C:
  • 130000.0 mPa·s (cP)

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

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