Part no. (SKU/IDH):
1201771
IDH Name:
LOCTITE® ABLESTIK 2025D
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Non-conductive die-attach adhesive for array packaging
This red non-conductive die-attach adhesive is designed for plastic ball grip array (PBGA), FlexBGA and Stacking BGA applications.
Part no. (SKU/IDH):
1201771
IDH Name:
LOCTITE® ABLESTIK 2025D
Packaging type Please make your selection Any kind of pack., excl. bulk
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ABLESTIK 2025D is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for array packaging. It exhibits minimal resin bleed-out (RBO) and is typically used in plastic ball grid array (PBGA), FlexBGA, and Stacking BGA package applications. It cures when exposed to heat to form a strong material with excellent hot/wet die shear strength and good adhesion to many different substrates.
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Excellent resin bleed-out performance
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High hot/wet die shear strength
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260°C (500°F) reflow capability for Pb-free applications
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 48.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 140.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 9.0 ppm
- Extractable ionic content, Potassium (K+):
- 9.0 ppm
- Extractable ionic content, Sodium (Na+):
- 9.0 ppm
- Hot die shear strength:
- 3.5 kg-f
- RT die shear strength:
- 20.0 kg-f
- Tensile modulus, @ 250.0 °C:
- 116.0 N/mm² (16800.0 psi)
- Thermal conductivity:
- 0.4 W/mK
- Thixotropic index:
- 4.4
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 11500.0 mPa·s (cP)
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