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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Part no. (SKU/IDH):
1203572

IDH Name:
LOCTITE® ABLESTIK 2025D, Standard cartridge

Electrically non-conductive adhesives

LOCTITE® ABLESTIK 2025D

Non-conductive die-attach adhesive for array packaging

This red non-conductive die-attach adhesive is designed for plastic ball grip array (PBGA), FlexBGA and Stacking BGA applications.

Part no. (SKU/IDH):
1203572

IDH Name:
LOCTITE® ABLESTIK 2025D, Standard cartridge

Part no. (SKU/IDH) 1203572
LOCTITE® ABLESTIK 2025D, Standard cartridge

Packaging type Please make your selection Standard cartridge

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

LOCTITE® ABLESTIK 2025D is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for array packaging. It exhibits minimal resin bleed-out (RBO) and is typically used in plastic ball grid array (PBGA), FlexBGA, and Stacking BGA package applications. It cures when exposed to heat to form a strong material with excellent hot/wet die shear strength and good adhesion to many different substrates.

  • Product category:
  • Die attach adhesives

Technologies:

  • Applications:
  • Die attach

 

  • Coefficient of thermal expansion (CTE):
  • 48.0 ppm/°C

 

  • Coefficient of thermal expansion (CTE), Above Tg:
  • 140.0 ppm/°C

 

  • Cure type:
  • Heat cure

 

  • Extractable ionic content, Chloride (CI-):
  • 9.0 ppm

 

  • Extractable ionic content, Potassium (K+):
  • 9.0 ppm

 

  • Extractable ionic content, Sodium (Na+):
  • 9.0 ppm

 

  • Hot die shear strength:
  • 3.5 kg-f

 

  • RT die shear strength:
  • 20.0 kg-f

 

  • Tensile modulus, @ 250.0 °C:
  • 116.0 N/mm² (16800.0 psi)

 

  • Thermal conductivity:
  • 0.4 W/mK

 

  • Thixotropic index:
  • 4.4

 

  • Viscosity, Brookfield CP51, @ 25.0 °C:
  • 11500.0 mPa·s (cP)

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

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