Underfills
Epoxy underfill with excellent thermal performance
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Packages (WLCSPs) production. It is compatible with most lead-free solders.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ECCOBOND UF 3812 is a halogen-free underfill that shows stable performance under thermal stress. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. It can be used with most Pb-free solders; is designed for the production of BGA, CSP and WLCSPs; and is formulated to flow at room temperature with no additional preheating required.
-
Halogen-free
-
1-part: no mixing required
-
High reworkability
-
High glass transition temperature (Tg)
- Product category:
- Underfills
Technologies:
-
Thermosets, electronics assembly materials
- Applications:
- Encapsulating; Underfilling
- Coefficient of thermal expansion (CTE), Above Tg:
- 175.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 48.0 ppm/°C
- Color:
- Black
- Cure schedule, @ 130.0 °C:
- 10.0 min.
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 131.0 °C
- Pot life:
- 3.0 day
- Storage modulus, DMA, @ 25.0 °C:
- 3004.0 N/mm² (435580.0 psi)
- Storage temperature:
- -20.0 °C
- Viscosity, Physica, @ 25.0 °C:
- 350.0 mPa·s (cP)
- Work life:
- 1.0 day
