Part no. (SKU/IDH):
2310026
IDH Name:
LOCTITE® ECCOBOND UF 3812, 55 ml Syringe
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Epoxy underfill with excellent thermal performance
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Package (WLCSPs) production. It is compatible with most lead-free solders.
Part no. (SKU/IDH):
2310026
IDH Name:
LOCTITE® ECCOBOND UF 3812, 55 ml Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ECCOBOND UF 3812 is a halogen-free underfill that shows stable performance under thermal stress. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. It can be used with most Pb-free solders; is designed for the production of BGA, CSP and WLCSPs, and is formulated to flow at room temperature with no additional preheating required.
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Halogen-free
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1-part: no mixing required
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High reworkability
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High glass transition temperature (Tg)
- Applications:
- Encapsulating; Underfilling
- Coefficient of thermal expansion (CTE), Above Tg:
- 175.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 48.0 ppm/°C
- Color:
- Black
- Cure schedule, @ 130.0 °C:
- 10.0 min
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 131.0 °C
- Pot life:
- 3.0 day
- Storage modulus, DMA, @ 25.0 °C:
- 3004.0 N/mm² (435580.0 psi)
- Storage temperature:
- -20.0 °C
- Viscosity, Physica, @ 25.0 °C:
- 350.0 mPa·s (cP)
- Work life:
- 1.0 day
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