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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Part no. (SKU/IDH):
1824593

IDH Name:
LOCTITE® ECCOBOND UF 3811, 50 ml Barrel/drum

Underfills

LOCTITE® ECCOBOND UF 3811

Halogen-free, low-viscosity reworkable underfill 

This reworkable, low-viscosity underfill encapsulant is specially formulated to flow at room temperature: no additional preheating required. 

Part no. (SKU/IDH):
1824593

IDH Name:
LOCTITE® ECCOBOND UF 3811, 50 ml Barrel/drum

Part no. (SKU/IDH) 1824593
LOCTITE® ECCOBOND UF 3811, 50 ml Barrel/drum

Packaging type Please make your selection Barrel/drum

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

LOCTITE® ECCOBOND UF 3811 is a halogen-free, reworkable, low-viscosity epoxy underfill specially designed for Ball Grid Array (BGA) and Chip Scale Packaging (CSP) applications. It flows at room temperature with no additional preheating required, and cures quickly at moderate temperatures to minimize stress to other components. When cured, it has a high glass transition temperature while maintaining flexibility, so solder joints are protected during thermal cycling and drop testing. 

  • Product category:
  • Underfills

Technologies:

  • Coefficient of thermal expansion (CTE), Above Tg:
  • 190.0 ppm/°C

 

  • Coefficient of thermal expansion (CTE), Below Tg:
  • 61.0 ppm/°C

 

  • Cure schedule, @ 100.0 °C:
  • 60.0 min.

 

  • Glass transition temperature (Tg):
  • 124.0 °C

 

  • Viscosity, Brookfield, Physica, @ 25.0 °C:
  • 354.0 mPa·s (cP)

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

                                       

                                         

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