Part no. (SKU/IDH):
498733
IDH Name:
LOCTITE® ECCOBOND FP4526, 10 cc Syringe
Underfills
Low-viscosity epoxy underfill for flip-chip applications
This low-viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip-chip applications.
Part no. (SKU/IDH):
498733
IDH Name:
LOCTITE® ECCOBOND FP4526, 10 cc Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
- {{^distributor.unique}} {{/distributor.unique}} {{/distributor.isExpanded}} {{^distributor.isExpanded}} {{/distributor.isExpanded}} {{/distributor.isVisible}} {{/data}}
- Description
- Technical specification
LOCTITE® ECCOBOND FP4526 is a heat-curable 63%-filled underfill designed for capillary flow on flip chip applications. Its fast flow and low viscosity, along with its excellent wettability and adhesion, make it ideal for high-reliability applications. It can be used on ceramic, organic, solder mask and polyimide substrates, but is perfect for ceramic packages and FC on flex applications.
-
Excellent wettability
-
Excellent adhesion
-
Low viscosity
-
Fast flow
- Product category:
- Underfills
Technologies:
-
Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 101.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 33.0 ppm/°C
- Cure schedule, @ 165.0 °C:
- 15.0 min.
- Flexural modulus:
- 8500.0 N/mm² (1232500.0 psi)
- Glass transition temperature (Tg):
- 133.0 °C
- Viscosity, Brookfield Cone & Plate, @ 25.0 °C:
- 4700.0 mPa·s (cP)
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
- {{^distributor.unique}} {{/distributor.unique}} {{/distributor.isExpanded}} {{^distributor.isExpanded}} {{/distributor.isExpanded}} {{/distributor.isVisible}} {{/data}}
Our experts are here to learn more about your needs.
Our support center and experts are ready to help you find solutions for your business needs.