Fill encapsulants
Epoxy dam and fill encapsulant with excellent handling
This epoxy adhesive can be used as a dam or fill encapsulant, and has excellent handling properties.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ECCOBOND EO 1072 is a 1-part, fast curing, epoxy adhesive. It has a unique rheology allowing you to use it as both a dam and fill encapsulant. It has high Tg, low extractable ionics, good shelf life, and is ideal for applications requiring excellent handling properties.
-
High glass transition temperature (Tg)
-
Low extractable ionics
-
High performance
-
Good shelf life
- Product category:
- Damming materials
Technologies:
-
Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 123.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 43.0 ppm/°C
- Color:
- Black
- Cure schedule, @ 140.0 °C:
- 5.0 min.
- Cure type:
- Heat cure
- Elongation, at break:
- 0.9 %
- Glass transition temperature (Tg):
- 135.0 °C
- Shelf life:
- 183.0 day
- Shore hardness, Shore D:
- 90.0
- Storage temperature:
- 5.0 °C
