Underfills
Black epoxy underfill for preventing mechanical stress
Reworkable 1-part epoxy underfill for Ball Grid Array (BGA) and Chip Scale Packaging (CSP).
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® 3517M is a reliable, black liquid, epoxy-based underfill solution designed for the production of BGA and CSP. It's ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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High reliability and reworkability
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1 part: no mixing required
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Low halogen
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7-day pot life at 22°C (71.6°F)
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE):
- 65.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 191.0 ppm/°C
- Cure schedule light intensity:
- 30.0 mW/cm²
- Cure schedule, Recommended, @ 120.0 °C:
- 5.0 min.
- Glass transition temperature (Tg):
- 78.0 °C
- Viscosity, Haake PK1.2:
- 2600.0 mPa·s (cP)
