Part no. (SKU/IDH):
2053833
IDH Name:
LOCTITE® EA 9497, 400 ml Dual cartridge
Structural adhesives
High-performance, thermally-conductive metal-to-metal bonder
This 2-part, medium viscosity, high-performance adhesive is perfect for bonding metal sheets or electrical components when you need toughness and thermal conductivity.
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LOCTITE® EA 9497, 400 ml Dual cartridge en_GLLoctite 9497 B (1118766)IDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge en_GLIDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge en_GLLoctite 9497 A (1118765)IDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge en_GLLOCTITE EA 9497 B (2005142)IDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge en_GLLOCTITE EA 9497 A (2005132)IDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge en_GLLoctite 9497 A (1118765)IDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge en_GLLoctite 9497 B (1118766)IDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge es_MXIDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge es_MXLoctite 9497 B (1118766)IDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge es_MXLOCTITE EA 9497 B (2005142)IDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge en_GLLOCTITE EA 9497 B (2005142)IDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge es_MXLoctite 9497 A (1118765)IDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge en_GLLOCTITE EA 9497 A (2005132)IDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge en_GLIDH: 2053833
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LOCTITE® EA 9497, 400 ml Dual cartridge es_MXLOCTITE EA 9497 A (2005132)IDH: 2053833
Part no. (SKU/IDH):
2053833
IDH Name:
LOCTITE® EA 9497, 400 ml Dual cartridge
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® EA 9497 is a high-temperature-resistant structural bonder with thermal conductivity. This 2-part, medium-viscosity epoxy reliably bonds metal sheets or electrical components where toughness and thermal conductivity are required. Works in temperatures of up to 200°C (392°F) and provides large gap fill and high compression strength in harsh environments. Ideal for heat dissipation applications such as bonding metal sheets for high heat transfer and potting electrical components. It is also suitable for Surface Permanent Magnet (SPM) and Interior Permanent Magnet (IPM) bonding.
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High-performance, thermally-conductive structural bonder
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Temperature resistant up to 200°C (392°F)
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High impact and humidity resistance
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Large gap fill (up to 3 mm / 0.11 ")
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Room temperature, heat or induction cure
- Product category:
- Structural adhesives
Technologies:
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2K general epoxy
- Applications:
- Structural bonding
- Cure type:
- Room temperature (ambient) cure
- Hardener: Casson viscosity, cone & plate, @ 25.0 °C:
- 8.0 Pa∙s - 24.0 Pa∙s
- Hardener: Color:
- Gray
- Mix ratio, by volume:
- 2 : 1
- Mix ratio, by weight:
- 100 : 50
- Mixed: Pot life, @ 25.0 °C:
- 165.0 min - 255.0 min
- Mixed: Shear strength, Mild Steel (grit blasted):
- 20.0 N/mm²
- Mixed: Thermal conductivity:
- 1.4 W/mK
- Number of components:
- 2 part
- Resin: Casson viscosity, cone & plate, @ 25.0 °C:
- 5.0 Pa∙s - 16.0 Pa∙s
- Resin: Color:
- White
How to use
1. Ensure bonding surfaces are clean, dry and free of grease and other contaminants before bonding.
2. Resin and hardener must be mixed before application. If using dual cartridges, attach the supplied mixer nozzle and discard the first 3cm-8 cm (1.18"-3.15") of dispensed product before applying directly. For manual mixing, measure resin and hardener in the ratio 2: 1 Resin: Hardener and mix thoroughly. Once the color is uniform, continue mixing for approximately 15 seconds. Care should be taken when mixing large quantities due to the risk of excessive heat build-up.
3. Do not mix quantities greater than 4 kg in mass to limit heat build-up.
4. Apply the mixed adhesive as quickly as possible after mixing.
5. For maximum bond strength, apply adhesive to both surfaces and assemble parts immediately.
6. Keep assembled parts from moving during cure and allow sufficient time before loading.
7. Remove uncured adhesive with an organic solvent such as acetone.
8. Clean mixing and application equipment with hot soapy water before the adhesive hardens.
FAQ
It is a 2-part room temperature curing epoxy adhesive for bonding a wide variety of materials and demanding high-strength applications. It exhibits good thermal conductivity and high compressive strength.
The correct mix ratio is 2:1 by volume (resin:hardener) and 100:50 by weight.
The working life is 3 to 4 hours at 22°C. Higher temperatures and larger quantities reduce working time.
Yes. LOCTITE EA 9497 has good thermal conductivity (1.4 W/[m·K]) which makes it ideal for heat dissipation applications such as bonding metal sheets for heat transfer and potting electrical components.
Optimal storage is between 8°C and 21°C in the unopened container.
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