As AMRs and smart robotics take center stage in modern manufacturing, the pressure on electronics has never been higher. Rising heat, tighter spaces and tougher IP requirements are reshaping what “reliable automation” really means. Discover how advanced materials are powering the next generation of autonomous industrial systems.
Global Key Account Manager
The rapid evolution of Industry 4.0 and the emerging Industry 5.0 is transforming modern manufacturing at an unprecedented pace through advanced robotics, machine learning (ML) and artificial intelligence (AI). This shift is ushering in a new era of autonomous production environments that are smarter, more connected and far more capable.
Despite the momentum of digitization, many manufacturers are still early in their digital transformation journey. In 2025, only 28% of firms considered their operations to be “smart,” according to the National Association of Manufacturers (NAM) but by 2027, that number is expected to soar to 76%. At the same time, the business case for AI‑driven automation continues to strengthen with the industrial automation and control systems market is projected to grow at a CAGR of 10.6% from 2025 to 2030 due to the significant return on investment that AI‑enabled operations can deliver (Grand View Research).
As manufacturers integrate AMRs, AI-powered analytics, and next‑generation control systems, the need for a stronger technological foundation becomes unavoidable. High‑performing electronics now sit at the core of this foundation, ensuring the reliability, safety, and performance required for truly autonomous industrial environments.
Cyril Perducat, Chief Technology Officer at Rockwell Automation.
As robotics, drives and AI systems work together more closely, the expectations for speed, precision and uptime continue to climb. However, meeting these expectations requires manufacturers to manage several challenges at once:
- Greater heat generation as processors, drives and controllers become more powerful
- Smaller devices that pack heavier workloads into tighter spaces, placing power and communications circuitry in close proximity
- Pressure to reduce energy-intensive processes, electronic waste and increase efficiency of equipment in its use phase to support sustainability goals.
Additionally, demands for environmental robustness, particularly higher Ingress Protection (IP) ratings for AMRs and robotic systems operating in dusty, wet or corrosive environments, are rising rapidly. This is pushing manufacturers to design electronics and enclosures that can withstand harsher conditions beyond traditional factory floors.
Altogether, these factors put increased pressure on innovative materials to deliver strong performance and reliability while ensuring sustainability goals are also being met. The urgency to get industrial automation right has never been greater as failure to implement automation properly can undermine profitability, compromise safety, reduce productivity and erode market position.
The challenges described above have intensified the demand for advanced sustainable materials that enhance performance, reliability and sustainability of electronics. In smart factories, where systems are autonomous, connected and expected to run continuously, advanced materials reinforce the foundation of operations in critical areas:
- Thermal Management: As power density rises and devices become more compact, heat becomes a major challenge for autonomous platforms, drive systems and other high-demand electronics. As a result, effective thermal control becomes essential to keep these systems stable during continuous operation. Thermal interface materials such as GAP PAD® and SIL PAD®, which span a wide range of thermal conductivities from typical values around 1 – 10 W/m-.K up to advanced silicone free formulations capable of 40 W/m-.K, provide these thermal capabilities along with greases, gels and phase change materials.
- Protection: Industrial operations cause exposure of electronics to environmental contaminants such as temperature, moisture, corrosive materials and vibration. Therefore, protective solutions such as solvent-free conformal coatings, gasketing materials, sealants and potting compounds are used to safeguard vital electronics so they can operate continuously at peak performance.
- Integrity: Next generation systems of industrial automation demand both structural and electrical integrity. Advanced materials like threadlockers and structural adhesives provide structural integrity whereas electrically conductive adhesives, underfills and potting compounds deliver electrical integrity. Together, structural and electrical integrity meet the stringent demands of next-generation industrial automation systems by showcasing reliability and longevity.
Together, these materials help automation systems stay fast, accurate and operational. They enable the shift to smarter manufacturing by giving electronics the thermal performance, protection and design integrity needed to operate at scale.
As the industrial landscape accelerates towards more automated, connected and energy‑efficient operations, the reliability of electronics becomes a decisive factor in long‑term success and payoff. Advanced materials play a crucial role in supporting this shift by delivering the thermal performance, environmental protection and integrity required by increasingly compact electronics and robust power systems. Ultimately, advanced materials act as the foundation that supports electronics in meeting the escalating demands of Industry 4.0 and the emerging Industry 5.0.
With a global innovation network, dedicated electronics laboratories and deep expertise in materials development, Henkel continues to invest in next‑generation encapsulation, structural bonding and thermal technologies, including GAP PAD® materials, SIL PAD® materials, phase change materials, LIQUI-FORM® products and thermal adhesives. The company’s commitment is reinforced by strong collaboration with OEMs and Tier suppliers to accelerate the adoption of advanced materials across critical industrial and power electronics applications.
Eric Zhai, Global Market Strategy Sr Manager at Henkel
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