Potting compounds
Heat- and humidity-resistant, solvent-free potting adhesive
This soft, solvent-free, 2-part polyurethane potting material has low density and low viscosity, and excellent heat and humidity resistance.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
TEROSON® PU U333/U102 is a potting material specially adapted for encapsulating electronic components for protection against mechanical stress and environmental attacks. This soft, solvent-free material has excellent heat and humidity resistance, as well as great adhesion on many plastics and metals.
-
Solvent-free
-
Excellent heat resistance
-
Excellent humidity resistance
-
Great adhesion
-
Fast gelling
- Product category:
- Encapsulants
Technologies:
-
2K liquid
- Applications:
- Encapsulating
- Key characteristics:
- Heat resistant,Humidity resistant,Viscosity: low viscosity
- Number of components:
- 2 part
