Learn how Henkel solutions can protect temperature-sensitive components on a circuit board to ensure optimum performance.
Managing heat on electronic assemblies is a major concern for engineers. Henkel's Thermal Interface Materials (TIM) are a proven solution used for decades to successfully draw heat away from temperature-sensitive components on a circuit board to ensure optimum performance.
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Excessive heat can reduce the performance and reliability of assemblies, leading to catastrophic failure. -
Air must be replaced with Thermal Interface Materials to facilitate heat transfer from component to environment. -
Gap pad, gap filler, phase change, gel and thermal adhesives are thermal management solution options for electronic assemblies.
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