Sustainable packaging is often defined by materials. Yet thermal processes at the end of the packaging line also have a direct impact on energy use, CO₂ emissions and the overall environmental footprint.
When companies aim to make their packaging more sustainable, the focus is usually on materials. Recyclable board, alternative fibers and lower packaging weights are high on the agenda. These measures are important, and regulatory developments such as the Packaging & Packaging Waste Regulation (PPWR) are making them even more relevant.
But while materials have a major influence on environmental performance, they tell only part of the story. Packaging is not only designed and sourced – it is also produced. And that production process creates energy demand and emissions that often receive far less attention than the packaging material itself.
At the same time, expectations for manufacturers are changing. Rising energy costs, ambitious climate targets and new CSRD reporting requirements are increasing the pressure to make value-chain emissions more transparent and reduce them in a targeted way. As a result, process steps once viewed mainly through the lens of performance and uptime are moving into focus. One of these areas sits at the very end of the packaging line.
Many manufacturers closely analyze their largest energy consumers. Production equipment, compressed air systems, cooling technology and building infrastructure are continuously monitored and optimized. What is examined far less often is the thermal energy required to bond and seal packaging.
When hot melts are used, melters, hoses and nozzles must be kept at processing temperature continuously. This energy demand often runs for many hours, or even around the clock. Because it is distributed across many individual systems and rarely assessed separately, its impact on the CO₂ footprint often remains hidden.
As requirements for energy efficiency and decarbonization increase, this perspective is shifting. Companies no longer want to know only how much energy they consume, but also where that energy is used and which measures can make a measurable contribution to emissions reduction. Thermal process energy at the end of the packaging line is therefore evolving from an operational detail into a strategic sustainability topic.
For years, the packaging industry has focused on recyclability, material reduction and circularity. These topics remain essential. At the same time, it is becoming increasingly clear that sustainability does not stop at the material level. Processing conditions also influence a package’s environmental footprint. Temperature, energy demand and material use all help determine how resource-efficient a packaging solution truly is.
One particularly relevant factor is adhesive processing temperature. Many conventional hot melts are applied at around 150 to 180 °C. These temperatures must not only be reached, but also maintained consistently throughout production.
Low-temperature hot melts take a different approach. Lower processing temperatures can reduce the energy required to melt the adhesive and keep it at application temperature. They can also reduce thermal stress on the equipment. Modern adhesive formulations can also help reduce material use without compromising packaging performance. This makes the adhesive more than a consumable. It becomes an enabler of more sustainable packaging production.
Sustainability is increasingly assessed through data. What matters is no longer only the intention to reduce emissions, but the ability to demonstrate improvements in a transparent and traceable way. That is why continuously running processes are becoming more important. Even relatively small savings per operating hour can add up over the course of a year, creating tangible effects on energy consumption and CO₂ emissions.
Practical applications show that modern low-temperature adhesives can reduce both energy demand and adhesive consumption. Actual results depend on factors such as line configuration, production volume and operating hours. The underlying principle, however, remains the same: thermal optimization can make existing packaging processes more sustainable without requiring a fundamental change to the line architecture.
Henkel’s Technomelt® Supra Cool low-temperature adhesive technology is one example of this approach. It is designed to enable packaging processes at lower application temperatures and can help reduce energy consumption and CO₂ emissions.
The key point goes beyond any single technology: decarbonization is not driven only by major investments or new equipment. Relevant potential often lies in everyday processes that run quietly in the background and are therefore rarely questioned.
Sustainable packaging is not created by better materials alone. How efficiently that packaging is produced is equally important.
End-of-line processes give companies an opportunity to make previously overlooked energy consumption visible and optimize it in a targeted way. Modern low-temperature adhesives show that even relatively small process adjustments can help reduce energy demand and CO₂ emissions.
For sustainability leaders, operations managers and procurement teams, this opens up an additional perspective on packaging. The environmental footprint is shaped not only by the material, but also by the way the package is produced.Therefore, the decarbonization of packaging does not begin with the box alone. It also starts in the final meters of the packaging line.
The environmental footprint of packaging is not determined by material choice alone. Energy use, process steps and operating materials also influence the emissions generated during production.
When hot melt adhesives are used, energy is required to keep melters, hoses and nozzles at processing temperature. These thermal processes contribute to the overall energy demand of the packaging line.
Low-temperature hot melts are hot melt adhesives processed at lower temperatures than conventional systems. This can reduce the energy required during the packaging process.
As expectations around sustainability, energy efficiency and value-chain transparency increase, processes that previously received little attention are moving into focus. End-of-line applications often offer potential that has not yet been assessed systematically.
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